The performance of today’ electronic products relies heavily on the integrity of the tiny connections between microchips and circuits, which can number as many as 2,200. These bonds are tested ...

Bond testing standards: With an increasing need for standards across the solar module manufacturing industry, setting a benchmark for assessing the bond between cells is a vitally important step for ...

To meet the requirements of your electrical safety testing applications, you can choose from a variety of instruments and systems that perform hipot, insulation-resistance (IR), ground-resistance, and ...

The industry’s unquenchable thirst for I/O density and faster connections between chips, particularly logic and cache memory, is transforming system designs to include 3D architectures, and hybrid ...

Part of the HYAMP III series of manual ground-bond testers from Associated Research, the Model 3145 provides up to 40 A of DC ground-bond test current for alternative-energy and solar test ...

As advanced packaging pushes deeper into the sub-10µm realm, traditional inspection and metrology systems are being forced to evolve with it. Hybrid bonding, a critical enabler of vertical integration ...

High-performance bonding materials like OEM-specified polyurethane and acrylic tapes are the ideal method when it comes to automotive attachment applications. Selecting the right tape for your ...