随着人工智能（AI）与高性能计算（HPC）技术的爆发式演进，业界对计算芯片的性能需求正呈指数级攀升。为响应这一需求，芯片产业持续突破技术桎梏——从更先进的制程节点，到2.5D/3D集成等创新封装技术，每一次升级都推动芯片性能跃上新台阶。但随之而来的， ...

A retrodirective array (RDA) enabled by specifically designed CMOS chips for two-way wireless communication demonstration, featuring automatic beam tracking and ...

SEOUL, South Korea--(BUSINESS WIRE)--Dongbu HiTek today announced that it will present new insights into its best-in-class Analog CMOS and BCDMOS processing/design technologies at the PCIM (Power ...

Cambridge, MA – The advanced semiconductor material gallium nitride will likely be key for the next generation of high-speed communication systems and the power electronics needed for state-of-the-art ...

A project at MIT's Picower Institute for Learning and Memory has developed a sensor chip suited in particular to enhanced imaging of neural activity. Described in Nature Communications, the chip ...

The M16C/29 is a group of 16-bit, single chip control microcontrollers that featuring high-performance silicon gate CMOS technology. It offers instructions for high-level efficiency, designed for ...

The cost and performance of commercial spark optical emission spectrometer (OES) instruments depends on many things, including the type of detector technology employed in the instrument. Recently, ...

Fabless integrated circuit companies rely on foundry process design kits, supplied by the fab, to create new products. The design kit contains electrical and physical models of the devices available ...