The Compact Model Coalition of the Silicon Integration Initiative (Si2) has issued a call for papers for its inaugural International Compact Modeling Conference (ICMC), scheduled for June 26-27, at ...

RESEARCH TRIANGLE PARK, N.C.--(BUSINESS WIRE)--Semiconductor Research Corporation (SRC) recently joined the National Science Foundation (NSF) as a partner in an ongoing NSF project to further develop ...

Artificial intelligence/Machine Learning-driven modeling reduces time-to-market for faster Design Technology Co-Optimization development and accelerates model parameter extraction for advanced nodes, ...

Chinese artificial intelligence start-up StepFun has unveiled a compact AI model, Step 3.5 Flash, that it says can rival far ...

As semiconductor technologies advance, device structures are becoming increasingly complex. New materials and architectures introduce intricate physical effects requiring accurate modeling to ensure ...

Artificial intelligence/Machine Learning-driven modeling reduces time-to-market for faster Design Technology Co-Optimization development and accelerates model parameter extraction for advanced nodes, ...

A new technical paper titled “A Comprehensive Technique Based on Machine Learning for Device and Circuit Modeling of Gate-All-Around Nanosheet Transistors” was published by researchers at National ...