Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

Manufacturing technologies have been the first domain to experience this transformation. The review documents how artificial ...

Vivet Technology's Repeating Layer Process (RLP) replaces traditional sequential assembly lines with simultaneous production steps, eliminating bottlenecks and enabling manufacturers to scale capacity ...