A lack of planarity along the interface between the solder and the ceramic raft in an IGBT module is a common anomaly that can make heat dissipation uneven across the die and cause the die to crack.

Wilsonville, OR. Mentor Graphics today announced a new MicReD Power Tester 600A product, which tests electric and hybrid vehicle (EV/HEV) power electronics reliability during power cycling. The MicReD ...