A newly designed robust mechanophore provides early warning against mechanical failure while resisting heat and UV, report ...

A newly designed robust mechanophore provides early warning against mechanical failure while resisting heat and UV, report ...

With the semiconductor industry moving toward 3D DRAM, 3D logic architectures, and 1000+ layer 3D NAND stacks, 1 mechanical failures may become more common. Due to the complexity of these structures, ...

Cell-to-cell junctions were visualized by ZO1-GFP, and the dynamics of cell junctions were captured by movies. When the cells indicated by * were spontaneously stretched, a continuous belt of cell ...

Managing thermal and mechanical stress in multi-die assemblies will require a detailed knowledge of how and where a device will be used, how it will be packaged, and where stresses could cause ...

Cell membranes play a crucial role in maintaining the integrity and functionality of cells. However, the mechanisms by which they perform these roles are not yet fully understood. Scientists have used ...

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...