Intel, Samsung, and TSMC will collaborate on 450mm silicon wafers; once chip companies have made the move, users should start to see higher-performing chips at lower prices Chip makers Intel, Samsung ...

'Chip binning' is supposed to be the process of testing newly manufactured silicon to see how many of the important bits work and how high the thing will clock. But TSMC seems to be taking the notion ...

With typical lot sizes of 25 wafers and finished wafer values ranging from $4,000 to $17,000, depending on complexity, a ...

Partially defective, marginal die can still be functional enough to pass final electrical test. Some of these “walking wounded” chips get past final testing, but in the customer’s end product, under ...

KLA leverages cutting-edge semiconductor inspection tech, partnering with industry leaders like TSMC and Samsung. This positions them to capitalize on the growing demand for 2nm and 3nm chip ...

Nexperia owner Wingtech says the China unit produced more than 11 billion chips since mid-October, despite wafer supply ...

Cerebras Systems and the federal Department of Energy's National Energy Technology Laboratory today announced that the company's CS-1 system is more than 10,000 times faster than a graphics processing ...

The Biden-Harris Administration has imposed export controls and technology restrictions on China's advanced chip sector from 2022 to 2024. Recently, the US announced the initiation of a Section 301 ...

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...