Extensive Array of Back-End and Advanced Packaging Wet Wafer Process Equipment Leverages ACM’s Experience to Address Emerging Requirements for Wafer-Level Packaging FREMONT, Calif., Oct. 15, 2020 ...

TORONTO, Aug. 12, 2025 /PRNewswire/ - Xanadu, the leading photonic quantum computing company, and DISCO Corporation, renowned precision machine and processing tool manufacturer, are developing ...

TORONTO, Aug. 12, 2025 /CNW/ - Xanadu, the leading photonic quantum computing company, and DISCO Corporation, renowned precision machine and processing tool manufacturer, are developing advanced wafer ...

The German production manufacturer has announced the development of a new process for the texturing of diamond wire cut multi silicon wafers. Schmid says that it will ship the first systems featuring ...

The 350 mm diameter center opening in the RotoRing300 TM rotary table easily accommodates large 300 mm (12”) semiconductor wafers, allowing for eased extraction of the chip dies from the wafer during ...

US-Based wafer producer 1366 Technologies and ‘Silicon Module Super League’ (SMSL) member Hanwha Q CELLS have jointly achieved cell conversion efficiencies of 19.9%, up from 19.6% announced in ...

DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/zjghfx/silicon_wafers) has announced the addition of the "Silicon Wafers for ...

Trade body, VDMA has made key updates to the 10th edition of the International Technology Roadmap for Photovoltaics (ITRPV) to incorporate the ongoing and rapidly changing wafer size transition as ...

Modern semiconductor fabrication involves aligning silicon wafers and photolithography masks to nanometre precision. As the industry shifts from using 200 mm diameter wafers to 300 mm wafers, ...