定于1月6日开幕，预计主要企业将发布新芯片，吸引业界广泛关注。据 《商业时报》 报道， AMD 、高通和英伟达即将推出的处理器均计划由台积电制造，主要采用其3纳米和5纳米工艺技术，这凸显了台积电先进节点的持续势头。

IT之家 1 月 6 日消息，在今日的 CES 2026 主题演讲中，AMD 展示了其下一代及首款 2nm EPYC Venice Zen6 CPU 和 Instinct MI455X GPU，专为 Helios AI Racks 设计。

Announced at CES 2026, AMD's latest Ryzen mobile processors will crunch up to 60 trillion AI operations per second, with the ...

In addition to updated Ryzen AI 300 series processors and the new Ryzen AI 400 series unveiled at CES 2026, the company ...

The new processor is a souped-up version of the AMD Ryzen 7 9800X3D. It's called the AMD Ryzen 7 9850X3D, and although it ...

AMD's new-for-2026 Ryzen 7 9850X3D processor kicks up the clocks and packs the same extra-fast cache in an effort to outpace the well-regarded Ryzen 7 9800X3D.

AMD’s Ryzen CPU announcements this year fall firmly into the latter camp—these are all gently tweaked variants of chips that ...

The AMD keynote will be presented by CEO Lisa Su. We expect to hear about a lot of AI developments -- and maybe some new ...

News Highlights AMD provided an early look at its “Helios” rack-scale platform, the blueprint for yotta-scale AI ...

With eight cores, AMD's game-changing 3D V-Cache tech, and boosted clock speed the Ryzen 7 9850X3D is set to take the frame ...

An early glimpse at the CPUs and GPUs powering the PCs of tomorrow. Here's a rundown of the chips we hope to see from Intel, ...

AMD reveals its Helios rack-scale AI platform and next-generation Instinct MI400 GPUs at CES, highlighting exascale AI ...